Datasheet · 1988

SN5451/SN7451, SN54LS51/SN74LS51, SN54S51/SN74S51 AND-OR-Invert Gates (SDLS113)

TI data sheet showing that the standard 7451 (two 2-wide 2-input AOI gates) and the 74LS51 (one 2-wide 3-input section) differ in function and pin assignment — why a good 7451 can fail an IC tester's '51' test.

Author: Texas Instruments
Year: 1988
Type: Datasheet
Credit: Texas Instruments (https://www.ti.com/lit/gpn/sn5451).

7451
74ls51
and-or-invert
ttl
datasheet

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SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 – DECEMBER 1983 – REVISED MARCH 1988 Copyright  1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 – DECEMBER 1983 – REVISED MARCH 1988 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 – DECEMBER 1983 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 – DECEMBER 1983 – REVISED MARCH 1988 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 – DECEMBER 1983 – REVISED MARCH 1988 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN5451, SN54LS51, SN54S51 SN7451, SN74LS51, SN74S51 AND-OR-INVERT GATES SDLS113 – DECEMBER 1983 – REVISED MARCH 1988 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2026 PACKAGING INFORMATION Orderable part number Status Material type (1) (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material MSL rating/ Peak reflow (4) (5) Op temp (°C) Part marking (6) JM38510/00502BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 00502BCA JM38510/00502BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 00502BCA JM38510/00502BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 00502BCA JM38510/07401BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 07401BCA JM38510/07401BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 07401BCA JM38510/07401BDA Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 07401BDA JM38510/07401BDA.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 07401BDA JM38510/30401BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 30401BCA JM38510/30401BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 30401BCA JM38510/30401BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 30401BCA JM38510/30401BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 30401BCA M38510/00502BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 00502BCA M38510/00502BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 00502BCA M38510/07401BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 07401BCA M38510/07401BDA Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 07401BDA M38510/30401BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 30401BCA Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable part number 23-Oct-2026 Status Material type (1) (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material MSL rating/ Peak reflow (4) (5) Op temp (°C) Part marking (6) M38510/30401BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510/ 30401BCA SN5451J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN5451J SN5451J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN5451J SN5451J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN5451J SN5451J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN5451J SN54LS51J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54LS51J SN54LS51J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54LS51J SN54LS51J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54LS51J SN54LS51J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54LS51J SN54S51J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54S51J SN54S51J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SN54S51J SN74LS51D Obsolete Production SOIC (D) | 14 - - Call TI Call TI 0 to 70 LS51 SN74LS51D Obsolete Production SOIC (D) | 14 - - Call TI Call TI 0 to 70 LS51 SN74LS51DR Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LS51 SN74LS51DR Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LS51 SN74LS51DR.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LS51 SN74LS51DR.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 LS51 SN74LS51N Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74LS51N SN74LS51N Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74LS51N SN74LS51N.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74LS51N SN74LS51N.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74LS51N SN74LS51NSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 74LS51 SN74LS51NSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 74LS51 SN74LS51NSR.A Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 74LS51 SN74LS51NSR.A Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 74LS51 SN74S51D Last Time Buy Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 S51 SN74S51D Last Time Buy Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 S51 SN74S51D.A Last Time Buy Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 S51 Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com Orderable part number (1) 23-Oct-2026 Status Material type (1) (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material MSL rating/ Peak reflow (4) (5) Op temp (°C) Part marking (6) SN74S51D.A Last Time Buy Production SOIC (D) | 14 50 | TUBE Yes NIPDAU Level-1-260C-UNLIM 0 to 70 S51 SN74S51N Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74S51N SN74S51N Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74S51N SN74S51N.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74S51N SN74S51N.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 SN74S51N SNJ5451J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451J SNJ5451J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451J SNJ5451J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451J SNJ5451J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451J SNJ5451W Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451W SNJ5451W Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451W SNJ5451W.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451W SNJ5451W.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ5451W SNJ54LS51J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51J SNJ54LS51J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51J SNJ54LS51J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51J SNJ54LS51J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51J SNJ54LS51W Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51W SNJ54LS51W Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51W SNJ54LS51W.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51W SNJ54LS51W.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54LS51W SNJ54S51FK Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54S 51FK SNJ54S51FK.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54S 51FK SNJ54S51J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54S51J SNJ54S51J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 SNJ54S51J Status: For more details on status, see our product life cycle. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Oct-2026 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS51, SN54S51, SN74LS51, SN74S51 : • Catalog : SN74LS51, SN74S51 • Military : SN54LS51, SN54S51 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS51DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS51NSR SOP NS 14 2000 330.0 16.4 8.1 10.4 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS51DR SN74LS51NSR SOIC D 14 2500 353.0 353.0 32.0 SOP NS 14 2000 353.0 353.0 32.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2026 TUBE T - Tube height L - Tube length W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) JM38510/07401BDA W CFP 14 25 506.98 26.16 6220 NA JM38510/07401BDA.A W CFP 14 25 506.98 26.16 6220 NA M38510/07401BDA W CFP 14 25 506.98 26.16 6220 NA SN74LS51N N PDIP 14 25 506 13.97 11230 4.32 SN74LS51N N PDIP 14 25 506 13.97 11230 4.32 SN74LS51N.A N PDIP 14 25 506 13.97 11230 4.32 SN74LS51N.A N PDIP 14 25 506 13.97 11230 4.32 SN74S51D D SOIC 14 50 506.6 8 3940 4.32 SN74S51D.A D SOIC 14 50 506.6 8 3940 4.32 SN74S51N N PDIP 14 25 506 13.97 11230 4.32 SN74S51N N PDIP 14 25 506 13.97 11230 4.32 SN74S51N.A N PDIP 14 25 506 13.97 11230 4.32 SN74S51N.A N PDIP 14 25 506 13.97 11230 4.32 SNJ5451W W CFP 14 25 506.98 26.16 6220 NA SNJ5451W.A W CFP 14 25 506.98 26.16 6220 NA SNJ54LS51W W CFP 14 25 506.98 26.16 6220 NA SNJ54LS51W.A W CFP 14 25 506.98 26.16 6220 NA SNJ54S51FK FK LCCC 20 55 506.98 12.06 2030 NA SNJ54S51FK.A FK LCCC 20 55 506.98 12.06 2030 NA Pack Materials-Page 3 GENERIC PACKAGE VIEW FK 20 LCCC - 2.03 mm max height LEADLESS CERAMIC CHIP CARRIER 8.89 x 8.89, 1.27 mm pitch This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4229370\/A\ www.ti.com PACKAGE OUTLINE J0014A CDIP - 5.08 mm max height SCALE 0.900 CERAMIC DUAL IN LINE PACKAGE PIN 1 ID (OPTIONAL) A 4X .005 MIN [0.13] .015-.060 TYP [0.38-1.52] 1 14 12X .100 [2.54] 14X .014-.026 [0.36-0.66] 14X .045-.065 [1.15-1.65] .010 [0.25] C A B .754-.785 [19.15-19.94] 8 7 B .245-.283 [6.22-7.19] .2 MAX TYP [5.08] C .13 MIN TYP [3.3] SEATING PLANE .308-.314 [7.83-7.97] AT GAGE PLANE .015 GAGE PLANE [0.38] 0 -15 TYP 14X .008-.014 [0.2-0.36] 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. www.ti.com EXAMPLE BOARD LAYOUT J0014A CDIP - 5.08 mm max height CERAMIC DUAL IN LINE PACKAGE (.300 ) TYP [7.62] SEE DETAIL A SEE DETAIL B 1 14 12X (.100 ) [2.54] SYMM 14X ( .039) [1] 8 7 SYMM LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X .002 MAX [0.05] ALL AROUND (.063) [1.6] METAL ( .063) [1.6] SOLDER MASK OPENING METAL (R.002 ) TYP [0.05] .002 MAX [0.05] ALL AROUND SOLDER MASK OPENING DETAIL A DETAIL B SCALE: 15X 13X, SCALE: 15X 4214771/A 05/2017 www.ti.com PACKAGE OUTLINE D0014A SOIC - 1.75 mm max height SCALE 1.800 SMALL OUTLINE INTEGRATED CIRCUIT C 6.2 TYP 5.8 SEATING PLANE PIN 1 ID AREA A 0.1 C 12X 1.27 14 1 2X 7.62 8.75 8.55 NOTE 3 7 8 B 4.0 3.8 NOTE 4 SEE DETAIL A 14X 0.51 0.31 0.25 C A B 1.75 MAX 0.25 TYP 0.13 0.25 GAGE PLANE 0 -8 0.25 0.10 1.27 0.40 DETAIL A TYPICAL 4220718/A 09/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side. 5. Reference JEDEC registration MS-012, variation AB. www.ti.com EXAMPLE BOARD LAYOUT D0014A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 14X (1.55) SYMM 1 14 14X (0.6) 12X (1.27) SYMM 8 7 (R0.05) TYP (5.4) LAND PATTERN EXAMPLE SCALE:8X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220718/A 09/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0014A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 14X (1.55) SYMM 1 14 14X (0.6) 12X (1.27) SYMM 7 8 (5.4) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X 4220718/A 09/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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